Plated-through interconnect solder thief

Details Plated-through interconnect solder thief Plated-through interconnect solder thief

1991-12-23

1993-07-13

Picard, Leo P.

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

361400, 361403, 2281801, 2281802, 428901, H05K 100

Patent

active

052275892

ABSTRACT:
A plated-through hole solder thief for inhibiting solder bridges between adjacent leads of an integrated circuit and simultaneously providing for electrical interconnection of certain leads of the integrated circuit to other surfaces or layers of a printed wiring board. Plated-through holes are used as solder thieves and are located in the proximity of the last solder pad in a row of solder pads. The plated-through hole draws the solder from the last solder pad to fill the plated-through hole and inhibit bridging between functional leads of the integrated circuit as well as make an electrical interconnection between the last lead of the integrated circuit in each row and other surfaces or layers of the printed wiring board. The plated-through hole is located askew from the rows of solder pads so that functional use may be made of the plated-through hole once it is filled to provide a test point for testing the integrated circuit.

REFERENCES:
patent: 4339784 (1982-07-01), Shearer
patent: 4342977 (1982-08-01), McGalliard
patent: 4394639 (1983-07-01), McGalliard
patent: 4767892 (1988-08-01), Kobari
patent: 4835345 (1989-05-01), Haarde
patent: 4891472 (1990-01-01), Beurman et al.
patent: 5010448 (1991-04-01), Kobari

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