Plated through-holes in a printed circuit board

Details Plated through-holes in a printed circuit board Plated through-holes in a printed circuit board

1988-03-23

1990-03-27

Tufariello, T. M.

Chemistry: electrical and wave energy

Processes and products

C25D 502

Patent

active

049117963

ABSTRACT:
A process of forming plates through-holes in a printed circuit board involves placing a film of fluid ink having electrically conductive properties on a side wall of the hole, curing the film to a solid and electroplating a layer of metal on the conductive ink film. The conductive ink preferably is a composition including conductive particles such as carbon and silver flakes. The ink also preferably includes a thermosetting or radiation curable binder and a thinner. The film of ink is cured before the layer of metal is electroplated thereon. The plated through-hole is protected from the etchant when the conductors are etched by placing a radiation curable putty material into the hole, curing it, and then depositing a layer of resist on top of the cured putty and a conductive sheet clad to the substrate of the circuit board.

REFERENCES:
patent: 3261769 (1966-07-01), Coe

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