Plated-through hole plugs for eliminating solder seepage

Details Plated-through hole plugs for eliminating solder seepage Plated-through hole plugs for eliminating solder seepage

1989-02-23

1990-04-10

Nimmo, Morris H.

Chemistry: electrical and wave energy

Processes and products

174266, 427 97, C25D 502

Patent

active

049157957

ABSTRACT:
A process is illustrated to provide plated through holes for connecting between opposite sides of a circuit board such as an insulating ceramic substrate while maintaining a smooth surface on the circuit side to facilitate the process of defining the circuit pattern. The plated-through hole process is designed to uniformly cap or plug all of the plated-through holes to prevent solder from the backside from flowing through the holes to the circuit side and damaging (short-circuitry adjacent paths) the finished product.

REFERENCES:
patent: 3264402 (1966-08-01), Shaheen et al.
patent: 3464855 (1969-09-01), Shaheen et al.
patent: 3471631 (1969-10-01), Quintana
patent: 4191789 (1980-03-01), Brown et al.
patent: 4566186 (1986-01-01), Bauer et al.
patent: 4642160 (1987-02-01), Burgess
patent: 4743710 (1988-05-01), Shieber et al.
patent: 4789760 (1988-12-01), Koyama et al.

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