Electricity: electrical systems and devices – Electrostatic capacitors – Fixed capacitor
Reexamination Certificate
2006-08-10
2009-08-18
Ha, Nguyen T (Department: 2831)
Electricity: electrical systems and devices
Electrostatic capacitors
Fixed capacitor
C361S306100, C361S321100, C361S321200, C361S523000, C361S525000
Reexamination Certificate
active
07576968
ABSTRACT:
A multilayer electronic component includes a plurality of dielectric layers interleaved with a plurality of internal electrodes. Internal and/or external anchor tabs may also be selectively interleaved with the dielectric layers. Portions of the internal electrodes and anchor tabs are exposed along the periphery of the electronic component in respective groups. Each exposed portion is within a predetermined distance from other exposed portions in a given group such that termination structures may be formed by deposition and controlled bridging of a thin-film plated material among selected of the exposed internal conductive elements. Electrolytic plating may be employed in conjunction with optional cleaning and annealing steps to form directly plated portions of copper, nickel or other conductive material. Once an initial thin-film metal is directly plated to a component periphery, additional portions of different materials may be plated thereon.
REFERENCES:
patent: 369545 (1887-09-01), Monroe et al.
patent: 437011 (1890-09-01), Bentley
patent: 3258898 (1966-07-01), Garibotti
patent: 3448355 (1969-06-01), Ahearn, Jr. et al.
patent: 3612963 (1971-10-01), Piper et al.
patent: 3665267 (1972-05-01), Acello
patent: 3809973 (1974-05-01), Hurley
patent: 3898541 (1975-08-01), Weller
patent: 3988498 (1976-10-01), Maher
patent: 3992761 (1976-11-01), McElroy et al.
patent: 4241378 (1980-12-01), Dorrian
patent: 4266265 (1981-05-01), Maher
patent: 4486813 (1984-12-01), Maher
patent: 4555414 (1985-11-01), Hoover et al.
patent: 4574329 (1986-03-01), Eijkelenkamp et al.
patent: 4661884 (1987-04-01), Seaman
patent: 4681656 (1987-07-01), Byrum
patent: 4729058 (1988-03-01), Gupta et al.
patent: 4811162 (1989-03-01), Maher et al.
patent: 4811164 (1989-03-01), Ling et al.
patent: 4819128 (1989-04-01), Florian et al.
patent: 4831494 (1989-05-01), Arnold et al.
patent: 4852227 (1989-08-01), Burks
patent: 4919076 (1990-04-01), Lutz et al.
patent: 5021921 (1991-06-01), Sano et al.
patent: 5159300 (1992-10-01), Nakamura et al.
patent: 5196822 (1993-03-01), Gallusser et al.
patent: 5226382 (1993-07-01), Braden
patent: 5251094 (1993-10-01), Amano et al.
patent: 5311651 (1994-05-01), Kim et al.
patent: 5369545 (1994-11-01), Bhattacharyya et al.
patent: 5412357 (1995-05-01), Nakamura et al.
patent: 5493266 (1996-02-01), Sasaki et al.
patent: 5550705 (1996-08-01), Moncrieff
patent: 5576053 (1996-11-01), Senda et al.
patent: 5635894 (1997-06-01), Morant
patent: 5712758 (1998-01-01), Amano et al.
patent: 5753299 (1998-05-01), Garcia et al.
patent: 5770476 (1998-06-01), Stone
patent: 5863331 (1999-01-01), Braden et al.
patent: 5870273 (1999-02-01), Sogabe et al.
patent: 5880011 (1999-03-01), Zablotny et al.
patent: 5880925 (1999-03-01), DuPré et al.
patent: 5944897 (1999-08-01), Braden
patent: 5985414 (1999-11-01), Fukuda et al.
patent: 5990778 (1999-11-01), Strumpler et al.
patent: 6040755 (2000-03-01), Abe et al.
patent: 6141846 (2000-11-01), Miki
patent: 6151204 (2000-11-01), Shigemoto et al.
patent: 6159768 (2000-12-01), Ahn
patent: 6181544 (2001-01-01), Nakagawa et al.
patent: 6188565 (2001-02-01), Naito et al.
patent: 6191932 (2001-02-01), Kuroda et al.
patent: 6191933 (2001-02-01), Ishigaki et al.
patent: 6195249 (2001-02-01), Honda et al.
patent: 6201683 (2001-03-01), Yamada et al.
patent: 6214685 (2001-04-01), Clinton et al.
patent: 6232144 (2001-05-01), McLoughlin
patent: 6243253 (2001-06-01), DuPré´ et al.
patent: 6266229 (2001-07-01), Naito et al.
patent: 6288887 (2001-09-01), Yoshida et al.
patent: 6292351 (2001-09-01), Ahiko et al.
patent: 6310757 (2001-10-01), Tuzuki et al.
patent: 6311390 (2001-11-01), Abe et al.
patent: 6343004 (2002-01-01), Kuranuki et al.
patent: 6362723 (2002-03-01), Kawase
patent: 6370010 (2002-04-01), Kuroda et al.
patent: 6380619 (2002-04-01), Ahiko et al.
patent: 6392869 (2002-05-01), Shiraishi et al.
patent: 6407906 (2002-06-01), Ahiko et al.
patent: 6433992 (2002-08-01), Nakagawa et al.
patent: 6496355 (2002-12-01), Galvagni et al.
patent: 6525395 (2003-02-01), Kawase
patent: 6594136 (2003-07-01), Kuroda et al.
patent: 6621682 (2003-09-01), Takakuwa et al.
patent: 6661638 (2003-12-01), Jackson et al.
patent: 6661639 (2003-12-01), Devoe et al.
patent: 6661640 (2003-12-01), Togashi
patent: 6729003 (2004-05-01), Yokoyama et al.
patent: 6743479 (2004-06-01), Kanoh et al.
patent: 6765781 (2004-07-01), Togashi
patent: 6819543 (2004-11-01), Vieweg et al.
patent: 6822847 (2004-11-01), Devoe et al.
patent: 6870727 (2005-03-01), Edson et al.
patent: 6922329 (2005-07-01), Togashi
patent: 6960366 (2005-11-01), Ritter et al.
patent: 6969647 (2005-11-01), Devoe et al.
patent: 7258819 (2007-08-01), Harris, IV
patent: 7345868 (2008-03-01), van Trinh
patent: 2003/0011963 (2003-01-01), Ahiko et al.
patent: 2003/0071245 (2003-04-01), Harris, IV
patent: 2004/0257748 (2004-12-01), Ritter et al.
patent: 2008/0158774 (2008-07-01), van Trinh
patent: 0351343 (1990-01-01), None
patent: 0379066 (1990-07-01), None
patent: 1535662 (1978-12-01), None
patent: 1540403 (1979-02-01), None
patent: 2326976 (1999-01-01), None
patent: 2334377 (1999-08-01), None
patent: 2389708 (2003-12-01), None
patent: 63146421 (1988-06-01), None
patent: 6454720 (1989-03-01), None
patent: 1201902 (1989-08-01), None
patent: 01 293503 (1989-11-01), None
patent: 01313804 (1989-12-01), None
patent: 02 294007 (1990-12-01), None
patent: 6168845 (1994-06-01), None
patent: 09 129476 (1997-05-01), None
patent: 129477 (1997-05-01), None
patent: 9190946 (1997-07-01), None
patent: 023862 (2001-01-01), None
patent: 2164257 (2002-06-01), None
patent: WO 0234054 (2002-01-01), None
Translated Abstract of Japanese Patent No. 10313804 cited above.
Translated Abstract of Japanese Patent No. 6168845 cited above.
Translated Abstract of Japanese Patent No. 2164257 cited above.
English language abstract of Japanese Patent No. 08264372 published Oct. 11, 1996.
English language abstract of Japanese Patent No. 10251837 published Sep. 22, 1998.
Hung Van Trinh, “An Electrodeposition Method for Terminals of Multilayer Ceramic Capacitors,” Mar. 23, 2002 (a thesis submitted in partial satisfaction of the requirements for the degree Master of Science in Materials Science and Engineering, University of California-San Diego).
European Search Report for Application No. GB0308656.8 dated May 6, 2004.
European Search Report for Application No. GB0405993.7 dated Jul. 26, 2004.
Hung Van Trinh and Jan B. Talbot, “An Electrodeposition Method for Terminals of Multilayer Ceramic Capacitors” CARTS 2003: 23rd Capacitor and Resistor Technology Symposium Mar. 31-Apr. 3, 2003.
Hung Van Trinh and Jan B. Talbot, “Electrodeposition Method for Terminals of Multilayer Ceramic Capacitors,” Jun. 2003, vol. 86, No. 6, Journal of the American Ceramic Society.
Search Report under Section 17 for Application No. GB0425963.6, dated Jan. 26, 2005, Examiner: Tyrone Moore.
Search Report under Section 17 for Application No. GB0425961.0, dated Jan. 27, 2005, Examiner: Tyrone Moore.
European Search Report for Application No. GB0308656.8 dated Sep. 8, 2005.
English Abstract of Japanese Publication No. 01-293503 published Nov. 27, 1989.
English Abstract of Japanese Publication No. 02-294007 published Dec. 5, 1990.
English Abstract of Japanese Publication No. 09-129476 published May 16, 1997.
Extended European Search Report for European Patent Application No. 0711195 3.1-2214 dated Jan. 16, 2008.
Galasco Raymond T.
Galvagni John L.
Heistand, II Robert
Hulik John M.
Ritter Andrew P.
AVX Corporation
Dority & Manning P.A.
Ha Nguyen T
LandOfFree
Plated terminations and method of forming using electrolytic... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Plated terminations and method of forming using electrolytic..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Plated terminations and method of forming using electrolytic... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4055891