Plated terminations

Details Plated terminations Plated terminations

2005-12-06

2005-12-06

Thomas, Eric W. (Department: 2831)

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

C361S309000, C361S311000

Reexamination Certificate

active

06972942

ABSTRACT:
Improved termination features for multilayer electronic components are disclosed. Monolithic components are provided with plated terminations whereby the need for typical thick-film termination stripes is eliminated or greatly simplified. Such termination technology eliminates many typical termination problems and enables a higher number of terminations with finer pitch, which may be especially beneficial on smaller electronic components. The subject plated terminations are guided and anchored by exposed internal electrode tabs and additional anchor tab portions which may optionally extend to the cover layers of a multilayer component. Such anchor tabs may be positioned internally or externally relative to a chip structure to nucleate additional metallized plating material. External anchor tabs positioned on one or both of top and bottom surfaces of a monolithic structure can facilitate the formation of selective wrap-around plated terminations. The disclosed technology may be utilized with a plurality of monolithic multilayer components, including interdigitated capacitors, multilayer capacitor arrays, and integrated passive components. A variety of different plating techniques and termination materials may be employed in the formation of the subject self-determining plated terminations.

REFERENCES:
patent: 369545 (1887-09-01), Monroe et al.
patent: 3258898 (1966-07-01), Garbotti
patent: 3448355 (1969-06-01), Ahearn, Jr. et al.
patent: 3809973 (1974-05-01), Hurley
patent: 3898541 (1975-08-01), Weller
patent: 3988498 (1976-10-01), Maher
patent: 3992761 (1976-11-01), McElroy et al.
patent: 4241378 (1980-12-01), Dorrian
patent: 4266265 (1981-05-01), Maher
patent: 4574329 (1986-03-01), Eijkelenkamp et al.
patent: 4661884 (1987-04-01), Seaman
patent: 4811162 (1989-03-01), Maher et al.
patent: 4811164 (1989-03-01), Ling et al.
patent: 4852227 (1989-08-01), Burks
patent: 4919076 (1990-04-01), Lutz et al.
patent: 5021921 (1991-06-01), Sano et al.
patent: 5226382 (1993-07-01), Braden
patent: 5251094 (1993-10-01), Amano et al.
patent: 5311651 (1994-05-01), Kim et al.
patent: 5576053 (1996-11-01), Senda et al.
patent: 5753299 (1998-05-01), Garcia et al.
patent: 5770476 (1998-06-01), Stone
patent: 5863331 (1999-01-01), Braden et al.
patent: 5880011 (1999-03-01), Zablotny et al.
patent: 5880925 (1999-03-01), DuPre et al.
patent: 5944897 (1999-08-01), Braden
patent: 6141846 (2000-11-01), Miki
patent: 6159768 (2000-12-01), Ahn
patent: 6188565 (2001-02-01), Naito et al.
patent: 6191932 (2001-02-01), Kuroda et al.
patent: 6214685 (2001-04-01), Clinton et al.
patent: 6232144 (2001-05-01), McLoughlin
patent: 6243253 (2001-06-01), DuPré et al.
patent: 6266229 (2001-07-01), Naito et al.
patent: 6310757 (2001-10-01), Tuzuki et al.
patent: 6380619 (2002-04-01), Ahiko et al.
patent: 6496355 (2002-12-01), Galvagni et al.
patent: 6594136 (2003-07-01), Kuroda et al.
patent: 6621682 (2003-09-01), Takakuwa et al.
patent: 6661638 (2003-12-01), Jackson et al.
patent: 6661639 (2003-12-01), Devoe et al.
patent: 6729003 (2004-05-01), Yokoyama et al.
patent: 6743479 (2004-06-01), Kanoh et al.
patent: 6822847 (2004-11-01), Devoe et al.
patent: 2003/0011963 (2003-01-01), Ahiko et al.
patent: 2004/0090733 (2004-05-01), Devoe et al.
patent: 2005/0057887 (2005-03-01), Devoe et al.
patent: 0351343 (1990-01-01), None
patent: 0379066 (1990-07-01), None
patent: 1540403 (1979-02-01), None
patent: 2334377 (1999-08-01), None
patent: 2389708 (2003-12-01), None
patent: 1313804 (1989-12-01), None
patent: 6168845 (1994-06-01), None
patent: 2164257 (2002-06-01), None
Search Report under Section 17 for Application No. GB0425961.0, Date of Search: Jan. 27, 2005.
Search Report under Section 17 for Application No. GB0425963.6, Date of Search: Jan. 26, 2005.
Hung Van Trinh, An Electrodeposition Method for Terminals of Multilayer Ceramic Capacitors, Mar. 23, 2002, A thesis submitted in partial satisfaction of the requirements for the degree Master of Science in Materials Science and Engineering, University of California San Diego.
Hung Van Trinh and Jan B. Talbot Electrodeposition Method for Terminals of Multilayer Ceramic Capacitors Jun. 2003, vol. 86, No. 6 Journal of the American Ceramic Society.
Hung Van Trinh and Jan B. Talbot An Electrodeposition Method for Terminals of Multilayer Ceramic Capacitors CARTS 2003: 23rdCapacitor And Resistor Technology Symposium Mar. 31-Apr. 3, 2003.
Hung Van Trinh An Electrodeposition Method for Terminals of Multilayer Ceramic Capacitors A thesis submitted in partial satisfaction of the requirements for the degree Master of Science in Materials Science and Engineering University of California San Diego Mar. 23, 2002.
Translated Abstract of Japanese Patent No. 1-313804 cited above.
Translated Abstract of Japanese Patent No. 6168845 cited above.
Translated Abstract of Japanese Patent No. 2164257 cited above.
European Search Report for Application No. GB0308656.8 dated May 6, 2004.
European Search Report for Application No. GB0405993.7 dated Jul. 26, 2004.

Affiliated with

Also associated with

Rating

Plated terminations does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Plated terminations, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Plated terminations will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3475219