Plated electrical connectors

Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...

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Details

439 78, 439931, H01R 909

Patent

active

051278383

ABSTRACT:
A molded and plated or etched connector pair for mating together two printed wiring boards or the like. The female connector includes a column molded as a part of one PWB having a tapered passage therethrough. At least the inside of the tapered passage is plated with a conductive material which is connected to the bottom of the PWB through a plated through hole. The male connector member includes a block molded as a part of its PWB. The block includes a channel which mates with the column of the female connector. A plastic pin is disposed in the middle of the channel and mates with the tapered passage of the female member. The pin is plated with a conductive material and is coupled to the bottom of the male member's PWB via a plated through hole. The pin itself is tapered and has a tapered aperture passing all the way through it terminating in the plated through hole. The pin is also partially bisected at the top to provide relief for the pin to flex inward to provide spring force when the connectors are mated.

REFERENCES:
patent: 3529082 (1970-09-01), Hoesli
patent: 4029006 (1977-06-01), Mercer
patent: 4120330 (1978-10-01), Weismann
patent: 4233754 (1980-11-01), Dubuit
patent: 4414298 (1983-11-01), Krenz
patent: 4584767 (1986-04-01), Gregory
patent: 4591220 (1986-05-01), Impey
patent: 4645347 (1987-02-01), Rioux
patent: 4689103 (1987-08-01), Elarde
patent: 4692878 (1987-09-01), Ciongoli
patent: 4710419 (1987-12-01), Gregory
patent: 4749355 (1988-06-01), Hemmer
patent: 4764849 (1988-08-01), Khan
patent: 4791490 (1988-12-01), Knight et al.
patent: 4921453 (1990-05-01), O'Brien
IPC-MB-380 Draft Standard, Performance Specifications for Molded Printed Boards, Jan., 1987.
"Electrophoretic Photoresist Technology: An Image of the Future-Today", Vidusek, EPIC Winter Conference, Dec. 1988.
"Cast Spring"-A Plated, Molded Thermoplastic Electrical I/O Interface, Jack O'Brien, Connection Technology, Jun. 1989.
MINT-PAC Technologies Inc., "Solutions to Tomorrows Electronic Packaging Needs", Summer 1989 Promotional Literature.

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