Plated copper alloy material and process for production thereof

Details Plated copper alloy material and process for production thereof Plated copper alloy material and process for production thereof

2005-09-06

2005-09-06

Zimmerman, John J. (Department: 1775)

Stock material or miscellaneous articles

All metal or with adjacent metals

Composite; i.e., plural, adjacent, spatially distinct metal...

C428S648000, C428S675000, C428S929000, C428S935000, C205S176000, C205S181000, C205S182000, C205S226000, C439S886000, C439S887000

Reexamination Certificate

active

06939621

ABSTRACT:
A plated copper alloy material for connecting terminals is provided which comprises a parent material of copper or copper alloy, a nickel layer and a copper-tin alloy layer. The nickel layer has a thickness of 0.1-1.0 μm. The copper-tin alloy layer has a thickness of 0.1-1.0 μm and contains 35-75 at % of copper. The material may additionally have a tin layer no thicker than 0.5 μm for an engaging type terminal containing 0.001-0.1 mass % of carbon, or thicker than 0.5 μm for a non-engaging type connector. The material meets requirements for capability of insertion with a small force, good electric reliability (due to low contact resistance) in a high-temperature atmosphere, workability for sharp bending without cracking, good solder wettability and good corrosion resistance to sulfur dioxide gas.

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