Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate
2007-01-04
2009-10-06
Parekh, Nitin (Department: 2811)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Insulating material
C257S778000, C257S780000, C257S699000, C257SE23182
Reexamination Certificate
active
07598610
ABSTRACT:
A plate structure having a chip embedded therein, comprises an aluminum plate having at least one aluminum oxide layer formed on its surface, and a cavity therein; a chip embedded in the cavity, wherein the chip has an active surface; at least one electrode pad mounted on the active surface; and a build-up structure mounted on the surface of the aluminum plate, the active surface of the chip, and the surface of the electrode pad, wherein the build-up structure comprises at least one conducting to electrically connect to the electrode pad. Besides, a method of manufacturing a plate structure having a chip embedded therein is disclosed. Therefore, the plate structure having a chip embedded therein can be processed by a simple method to achieve the tenacity of aluminum and the rigidity of aluminum oxide.
REFERENCES:
patent: 6093970 (2000-07-01), Ohsawa et al.
patent: 6399418 (2002-06-01), Glenn et al.
patent: 6506632 (2003-01-01), Cheng et al.
patent: 6800941 (2004-10-01), Lee et al.
patent: 6919508 (2005-07-01), Forcier
patent: 2002/0034651 (2002-03-01), Yamagata et al.
patent: 2003/0124767 (2003-07-01), Lee et al.
patent: 2003/0227095 (2003-12-01), Fujisawa et al.
Chen Shang-Wei
Chia Kan-Jung
Hsu Shih-Ping
Lien Chung-Cheng
Bacon & Thomas PLLC
Parekh Nitin
Phoenix Precision Technology Corporation
LandOfFree
Plate structure having chip embedded therein and the... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Plate structure having chip embedded therein and the..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Plate structure having chip embedded therein and the... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4080606