Plate spring with improved settlement behavior

Details Plate spring with improved settlement behavior Plate spring with improved settlement behavior

2007-03-20

2007-03-20

Rodriguez, Pam (Department: 3683)

Spring devices

Bendable along flat surface

Bow spring or superposed spring elements

C029S896900

Reexamination Certificate

active

10901111

ABSTRACT:
A plate spring of a substantially circular-ring-shaped form having a substantially externally conical upper side (12) and a substantially internally conical underside (13) between which there are positioned an outer annular edge (14) and an inner annular edge (15), wherein, in the unloaded condition, the surface layer (17) of the underside (13) comprises a higher inherent compressive stress than the surface layer (16) of the upper side (12).

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patent: WO 00/77367 (2000-12-01), None
Patent Abstract of Japan, Publication No. 2000027915, Publication Date Jan. 25, 2000, Hayata Hideki.

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