Plate assembly

Details Plate assembly Plate assembly

2007-06-05

2007-06-05

Warden, Jill (Department: 1743)

Chemical apparatus and process disinfecting, deodorizing, preser

Control element responsive to a sensed operating condition

C422S105000

Reexamination Certificate

active

10626759

ABSTRACT:
A plate assembly has a plate member (1, 21, 101) having a recessed portion (3, 23, 103), and a lid member (2, 22, 102) mounted on the plate member to cover the recessed portion. A gap is formed between the plate member and the lid member around the recessed portion so as to allow a liquid to permeate the gap due to capillarity while preventing the liquid from entering the recessed portion. If the liquid is an adhesive, the lid member (2, 22) is bonded to the plate member (1, 21), the plate member having a bonded surface (4, 26) which is formed so as to surround the recessed portion (3, 23), the plate member having an adhesive relief portion (25) which is formed around the bonded surface so as to be recessed from the bonded surface, the gap being formed between the bonded surface and the lid member so as to allow the adhesive to permeate the gap due to capillarity. If the liquid may be a filler, the plate member (101) has a sealing surface (105) which is formed so as to surround the recessed portion (103), the plate member having a lid member fixing surface (107) which is separated from the sealing surface by a pass partition groove (106), the lid member (102) being fixed to the lid member fixing surface to form the gap between the sealing surface and the lid member so as to allow the filler to permeate the gap due to capillarity.

REFERENCES:
patent: 6406636 (2002-06-01), Vaganov
patent: 2002/0022261 (2002-02-01), Anderson et al.
patent: 2002/0053399 (2002-05-01), Soane et al.
patent: 2002/0079219 (2002-06-01), Zhao et al.
patent: 11-58437 (1999-03-01), None
Japanese Patent Laid-Open No. 11-58467 (published on Mar. 2, 1999).
Japanese Patent Laid-Open No. 2000-246092 (published on Sep. 12, 2000).
Japanese Patent Laid-Open No. 2000-288381 (published on Oct. 17, 2000).

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