Plastic surface mounted high pinout integrated circuit package

Details Plastic surface mounted high pinout integrated circuit package Plastic surface mounted high pinout integrated circuit package

1981-09-14

1984-07-31

Truhe, J. V.

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

357 74, H05K 500

Patent

active

044632177

ABSTRACT:
A surface mounted integrated (IC) device package or carrier is disclosed suitable for accommodating large terminal count IC devices in a small space. A carrier, preferably of plastic, is disclosed having notches or castillations in its sides. A first row of leads are positioned in the periphery of the package and a second row of leads are positioned in the notches, said notches formed a predetermined distance from the periphery of the package (e.g., 0.050"). Selected leads of the second row are alternated with said first row of leads. In the preferred embodiment, the first and second leads are separated by 0.025". Also in the preferred embodiment, the first and second row of leads extend over protuberances into depressions in the bottom of the package. Each of the depressions is separated by ribs from the other depressions such that the ends of the leads are disposed in the depressions and are prevented from substantial movement, thereby preventing contact with adjacent leads.

REFERENCES:
patent: 3416348 (1968-12-01), Carter, Jr. et al.
patent: 3614546 (1971-10-01), Avins
patent: 4059810 (1977-11-01), Paletto
patent: 4195193 (1980-03-01), Grabbe
patent: 4393581 (1983-07-01), Cherian

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