Plastic substrate production production device

Adhesive bonding and miscellaneous chemical manufacture – Surface bonding means and/or assembly means therefor – Automatic and/or material-triggered control

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Details

156361, 156495, 156498, 156522, 226 30, B32B 3100

Patent

active

057728348

ABSTRACT:
This invention relates to a plastic substrate production process, the production device for such a substrate, and the use of the process for the production of integrated circuit boards. The plastic substrate production process is characterized in that it comprises the following steps: unwinding and straightening of a continuous strip of plastic which is slightly larger in dimension than one of the dimensions of the board; printing, at at least one printing station, of a series of printing patterns and of printed markings; driving of the strip at a regulated printing speed; detection of the difference in speed; cutting by a press of the strip at positions defined by the printed markings; and regulation of the printing speed as a function of the difference between the printing speed and the driving speed.

REFERENCES:
patent: 3999279 (1976-12-01), O'Neal et al.
patent: 4303715 (1981-12-01), Chang
patent: 4526646 (1985-07-01), Suzuki et al.
patent: 4539058 (1985-09-01), Burgess et al.
patent: 4680079 (1987-07-01), Tanaka
patent: 4693778 (1987-09-01), Swiggett et al.
patent: 5094708 (1992-03-01), Bechtel et al.

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