Plastic semiconductor package having improved control of...

Details Plastic semiconductor package having improved control of... Plastic semiconductor package having improved control of...

2006-12-12

2006-12-12

Davis, Robert B. (Department: 1722)

Plastic article or earthenware shaping or treating: apparatus

With interposed non-adhering web or sheet type parting means

C425S116000, C425S125000, C425S127000, C425S129100

Reexamination Certificate

active

07147447

ABSTRACT:
A device with a semiconductor chip (801) assembled on a planar substrate (802) and encapsulation compound (810) surrounding the assembled chip and a portion of the substrate near the chip; the compound has a planar top area (811). The encapsulation compound has a plurality of side areas (812) reaching from the substrate to the top area; these side areas form edge lines with the top area, where the top area plane intersects with the respective plane of each side area. The encapsulation compound is recessed (813) along the edge lines so that the material is caved-in along the lines; this feature causes the recess to prevent any compound from the side area planes to reach the top area plane, whereby the planarity of the top area is preserved.

REFERENCES:
patent: 6261501 (2001-07-01), Miyagawa et al.
patent: 6344162 (2002-02-01), Miyajima
patent: 6511620 (2003-01-01), Kawahara et al.
patent: 2001/0013674 (2001-08-01), Shimizu et al.
patent: 2002/0015748 (2002-02-01), Miyajima et al.
patent: 2002/0025352 (2002-02-01), Miyajima
patent: 2000202864 (2000-07-01), None

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