Plastic-sealed IC device of heat-resistant construction

Details Plastic-sealed IC device of heat-resistant construction Plastic-sealed IC device of heat-resistant construction

1987-01-29

1989-09-12

Wojciechowicz, Edward J.

357 68, 357 70, H01L 2328

Patent

active

048665061

ABSTRACT:
A plastic-sealed IC device comprises an IC lead frame having a chip mounting area, an IC chip fixedly mounted on the IC lead frame in the chip mounting frame area, and a plastic package molded so as to seal the IC lead frame therein.
The plastic package has an opening formed so as to allow the backside of the chip mounting area to communicate with the atomonphere to discharge the moisture accumulating in the vicinity of the IC chip.

REFERENCES:
patent: 3902148 (1975-08-01), Drees et al.
patent: 4025716 (1977-05-01), Morse
patent: 4329701 (1982-05-01), Brenneman

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