Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate
2006-04-04
2006-04-04
Tran, Mai-Huong (Department: 2818)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
C428S209000, C428S322700, C428S323000, C428S418000, C428S901000, C257S678000, C257S780000, C438S106000, C438S118000, C438S123000
Reexamination Certificate
active
07023084
ABSTRACT:
The present invention provides a high heat dissipation plastic package and a method for making the same that provides an inexpensive, thin high heat dissipation plastic package with good bonding precision and minimal bleeding of adhesive resin.A Cu foil resin film is formed by bonding an adhesive resin to a Cu foil and pre-forming, at an essentially central position, a cut-out for a cavity used to mount a semiconductor element. The Cu foil resin film is bonded using the adhesive resin directly to a heat dissipation plate. A conductor wiring pattern is formed on the Cu foil resin film.Furthermore, the heat dissipation plate includes a stopping section used to prevent resin from bleeding onto a cavity when bonding with the adhesive resin of the Cu foil resin film.
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Communication Pursuant to Article 96(2) EPC dated Jul. 28, 2005.
Hamano Akihiro
Tomabechi Shigehisa
Darby & Darby
Sumitomo Metal (SMI) Electronics Devices Inc.
Tran Mai-Huong
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