Plastic packaging of microelectronic circuit devices

Details Plastic packaging of microelectronic circuit devices Plastic packaging of microelectronic circuit devices

1992-07-22

1997-01-28

Saadat, Mahshid D.

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

257707, H01L 2310, H01L 2334

Patent

active

055980341

ABSTRACT:
Thermally conductive heat transfer bodies are included in plastic packages to extend from the die pad and/or circuit chip to or near the surface of the package. Leakage is prevented by encapsulating the heat transfer body in a thin film of plastic and/or by arranging the interface between metal and plastic to be elongated and convoluted. The heat transfer body is attached to the die pad and/or lead frame to stabilize the body during molding and to aid in thermal communication between the chip and the heat transfer body. Air cavities and EMI shielding are provided by caps secured to the lead frames.

REFERENCES:
patent: 4663833 (1987-05-01), Tanaka et al.
patent: 4672418 (1987-06-01), Moran et al.
patent: 4672421 (1987-06-01), Lin
patent: 4723156 (1988-02-01), Okuaki
patent: 4727221 (1988-02-01), Saitau et al.
patent: 4784974 (1988-11-01), Butt
patent: 4926242 (1990-05-01), Itoh
patent: 4994897 (1991-02-01), Golubic et al.
patent: 5105259 (1992-04-01), McShane et al.

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