Plastic package with solder grid array

Details Plastic package with solder grid array Plastic package with solder grid array

1993-07-26

1994-11-08

Hearn, Brian E.

Fishing, trapping, and vermin destroying

437209, 437214, 437217, H01L 2160

Patent

active

053626796

ABSTRACT:
Solderable connections are formed in a grid array pattern on the surface of a plastic package by modifying conventional lead frame assemblies so that the outer ends of the leads terminate at the bottom surface of the package and forming solder pads or balls on the ends of the leads. Conventional lead frames are used and, after modification, are encapsulated using conventional plastic packaging techniques to form plastic packages with solderable terminal ends arranged in an interconnection array on one surface of the package.

REFERENCES:
patent: 4264917 (1981-04-01), Ugon
patent: 4452259 (1985-09-01), Butt
patent: 4987100 (1991-01-01), McBride et al.
patent: 5102828 (1992-04-01), Marchisi
patent: 5139969 (1992-08-01), Mori
patent: 5157480 (1992-10-01), McShane et al.
patent: 5172214 (1992-12-01), Casto
patent: 5206188 (1993-04-01), Hiroi et al.

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