Plastic package for radiation sensitive semiconductor devices

Details Plastic package for radiation sensitive semiconductor devices Plastic package for radiation sensitive semiconductor devices

1981-12-28

1984-07-17

James, Andrew J.

Electricity: conductors and insulators

Feedthrough or bushing

Compression

357 30, 357 80, 174 52FP, H01L 2714, H01L 2302, H01L 3902, H01L 2312

Patent

active

044609159

ABSTRACT:
A plastic package for radiation sensitive electrically programmable read-only memory devices is disclosed. A "slug" of ultraviolet transmissive material, such as fused quartz, sapphire, or other suitable material is bonded to the radiation sensitive surface of the semiconductor chip. The chip is wire bonded and die attached in the conventional manner, and is then encapsulated within a shell using existing epoxy techniques. The slug is shaped such that its upper surface is not covered during the encapsulating process, and thus ultraviolet radiation can penetrate through the slug and be diffused onto the chip thereby erasing the memory cells.

REFERENCES:
patent: 3622419 (1971-11-01), London et al.
patent: 3924246 (1975-12-01), Scherer
patent: 4186996 (1980-02-01), Bowen et al.
patent: 4326214 (1982-04-01), Trueblood

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