Plastic package and semiconductor component comprising such...

Details Plastic package and semiconductor component comprising such... Plastic package and semiconductor component comprising such...

2005-10-11

2009-06-30

Menz, Douglas M (Department: 2891)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Portion of housing of specific materials

C257S723000, C257SE23165, C257SE23166

Reexamination Certificate

active

07554196

ABSTRACT:
A plastic package and to a semiconductor component including such a plastic package, as well as to a method for its production is disclosed. In one embodiment, the plastic package includes plastic outer faces, which include lower outer contact faces on a lower side of the plastic package and upper outer contact faces on an upper side, which are connected together via outer conductor tracks. The conductor tracks include conduction paths which are formed on exposed conducting deposits in the plastic package.

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