Plastic molding device for a semiconductor element

Details Plastic molding device for a semiconductor element Plastic molding device for a semiconductor element

1986-02-13

1988-07-05

Hart, Charles

Plastic article or earthenware shaping or treating: apparatus

Control means responsive to or actuated by means sensing or...

Molding pressure control means responsive to pressure at...

425150, 425167, 425259, 425593, B29C 306

Patent

active

047551240

ABSTRACT:
A plastic molding device for a semiconductor element for plastic molding a semiconductor element on a lead frame, which comprises: an upper platen, a lower platen, and a movable platen movably provided at a tie bar which is provided between said two platens; an upper metal mold and a lower metal mold provided at the upper platen and the movable platen, respectively; a motor for applying a raising force for driving the movable platen; a driving force conversion mechanism for converting the rotation force of the motor into a reciprocal force; and a double toggle mechanism for giving the reciprocal force to the movable platen.

REFERENCES:
patent: 1298749 (1919-04-01), McManus
patent: 1922937 (1933-08-01), Eckert
patent: 2484344 (1949-10-01), Hiller et al.
patent: 2916770 (1959-12-01), LeMoine
patent: 3080610 (1963-03-01), Baigent
patent: 3184810 (1965-05-01), Hoern
patent: 3319298 (1967-05-01), Kiraly
patent: 3452399 (1969-08-01), Blumer
patent: 3534442 (1970-10-01), Mahle
patent: 3604058 (1971-09-01), Fishback
patent: 3642405 (1972-02-01), Eggenberger et al.
patent: 3723037 (1973-03-01), Formo
patent: 4021182 (1977-03-01), Resch
patent: 4131596 (1978-12-01), Allen
patent: 4235577 (1980-11-01), Groleau
patent: 4281977 (1981-08-01), Farrell
patent: 4422838 (1983-12-01), Iwawaki et al.
patent: 4540359 (1985-09-01), Yamazaki
patent: 4579515 (1986-04-01), Kawaguchi et al.
patent: 4601653 (1986-07-01), Inaba

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