Plastic molding device for a semiconductor element

Plastic article or earthenware shaping or treating: apparatus – Control means responsive to or actuated by means sensing or... – Molding pressure control means responsive to pressure at...

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Details

425150, 425167, 425259, 425593, B29C 306

Patent

active

051642034

ABSTRACT:
A plastic molding device for a semiconductor element for plastic molding a semiconductor element on a lead frame, which comprises: an upper platen, a lower platen, and a movable platen movably provided at a tie bar which is provided between said two platens; an upper metal mold and a lower metal mold provided at the upper platen and the movable platen, respectively; a motor for applying a raising force for driving the movable platen; a driving force conversion mechanism for converting the rotation force of the motor into a reciprocative force; and a double toggle mechanism for giving the reciprocative force to the movable platen.

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