Plastic molding device for a semiconductor element

Details Plastic molding device for a semiconductor element Plastic molding device for a semiconductor element

1988-03-29

1990-02-27

Hart, Charles

Plastic article or earthenware shaping or treating: apparatus

Control means responsive to or actuated by means sensing or...

Molding pressure control means responsive to pressure at...

425150, 4254516, B29C 306

Patent

active

049041738

ABSTRACT:
A plastic molding device for a semiconductor element for plastic molding a semiconductor element on a lead frame, which comprises: an upper platen, a lower platen, and a movable platen movably provided at a tie bar which is provided between said two platens; an upper metal mold and a lower metal mold provided at the upper platen and the movable platen, respectively; a motor for applying a raising force for driving the movable platen to; a driving force conversion mechanism for converting the rotation force of the motor into a reciprocative force; and a double toggle mechanism for giving the reciprocative force to the movable platen.

REFERENCES:
patent: 4755124 (1988-07-01), Tanaka et al.

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