Plastic molding apparatus

Details Plastic molding apparatus Plastic molding apparatus

1984-01-10

1985-11-26

Hoag, Willard E.

Static molds

Including means to apply force to remove or release product...

Pin or sleeve means

425116, 425185, 425556, 425444, B29C 100, B29C 700, B29D 300, B29F 114

Patent

active

045550867

ABSTRACT:
A plastic molding apparatus for molding a semiconductor element with a plastic by using transfer molds which comprising upper and lower heater plates, lower and upper molds disposed between the upper and lower heater plates, a first lower ejector plate disposed below the low heater plate, a second lower ejector plate disposed between the lower heater plate and the lower mold and connected to the first lower ejector plate through rods, lower ejector pins mounted on the second lower ejector plate capable of extending into mold cavity and a device for controlling the movement of the second lower ejector plate.

REFERENCES:
patent: 1992314 (1935-02-01), Laussucq
patent: 2571766 (1951-10-01), Saulino
patent: 2582891 (1952-01-01), Strauss
patent: 2923976 (1960-02-01), Strauss
patent: 3040378 (1962-06-01), Rodgers et al.
patent: 3317961 (1967-05-01), Drevalas et al.
patent: 3696507 (1972-10-01), Unger et al.
patent: 4124352 (1978-11-01), Pasch
patent: 4330257 (1982-05-01), Rees et al.
patent: 4370122 (1983-01-01), Daniels et al.
Japanese Patent Publication (KOKOKU), No. 57-59666, Dec. 15, 1982.

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