Plastic molded-type semiconductor device

Details Plastic molded-type semiconductor device Plastic molded-type semiconductor device

1990-09-05

1991-10-01

James, Andrew J.

Electricity: electrical systems and devices

Safety and protection of systems and devices

With specific current responsive fault sensor

357 70, 357 72, 357 74, 357 80, 361381, 361386, H01L 2302

Patent

active

050538551

ABSTRACT:
A semiconductor device comprises a die pad having first and second surfaces; a semiconductor chip having a plurality of electrodes and mounted on the first surface of the die pad; a radiator attached by caulking to the second surface of the die pad; a plurality of leads each of which has one end electrically connected to a corresponding electrode of the chip; and a resin package in which the die pad, the semiconductor chip, the radiator and the ends of the leads are molded. This semiconductor device exhibits excellent thermal radiator properties.

REFERENCES:
patent: 3930114 (1975-12-01), Hodge
patent: 3942245 (1976-03-01), Jackson et al.
patent: 4326238 (1982-04-01), Takeda et al.
patent: 4415025 (1983-11-01), Horvath
patent: 4561011 (1985-12-01), Kohara et al.
patent: 4607276 (1986-08-01), Butt
patent: 4620215 (1986-10-01), Lee
patent: 4642716 (1987-02-01), Wakabayashi et al.
patent: 4922324 (1990-05-01), Sudo

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