Plastic molded type semiconductor device

Details Plastic molded type semiconductor device Plastic molded type semiconductor device

1997-04-24

1999-03-02

Brown, Peter Toby

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With dam or vent for encapsulant

257786, H01L 23495

Patent

active

058775420

ABSTRACT:
Disclosed herein are a plastic molded type semiconductor device and a method of manufacturing the semiconductor device. The semiconductor device includes a semiconductor element having electrodes provided on a surface thereof, a dambar formed along the outer periphery of the surface of the semiconductor element, a plurality of leads respectively electrically connected to the electrodes and provided inside the dambar but electrically independent of the dambar, and a mold resin body within a region surrounded by the dambar and formed so as to expose parts of the leads.

REFERENCES:
patent: 5583375 (1996-12-01), Tsubosaki et al.
patent: 5684330 (1997-11-01), Lee

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