Plastic-molded-type semiconductor device

Details Plastic-molded-type semiconductor device Plastic-molded-type semiconductor device

1994-03-29

1996-01-30

Hille, Rolf

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

257675, 257706, 257712, 257719, 361688, 361709, 361711, H01L 2348, H01L 2302

Patent

active

054882540

ABSTRACT:
A plastic-molded-type semiconductor device is designed to prevent interfaces of a heat conductive member for heat radiation and plastic encapsulant from being separated from each other. The device is of a structure in which the heat conductive member for heat radiation is provided on and thermally connected to one side of a semiconductor chip, and the whole chip and the whole or a part of side surfaces of the heat conductive member are covered with the resin, the opposite side of the heat conductive member being exposed. In this structure, that portion of the heat conductive member which is covered with the resin has a cross-section whose configuration is any one of a circle, an ellipse, a polygon with corner portions whose internal angle is less than 180 degrees and a dull angle or which are rounded to have a low curvature. With this structure, shearing stress which acts on the adhesion interfaces between the heat conductive member and the resin can be decreased, and also, tightening force from the resin which is exerted on the side surfaces of the heat conductive member can be made uniform, so that separation of the adhesion interfaces can be prevented.

REFERENCES:
patent: 4345267 (1982-08-01), Corman et al.
patent: 4819041 (1989-04-01), Redmond
patent: 5057906 (1991-10-01), Ishigami
patent: 5073817 (1991-12-01), Ueda
patent: 5105259 (1992-04-01), McShane et al.

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