Plastic molded type power semiconductor device

Details Plastic molded type power semiconductor device Plastic molded type power semiconductor device

1990-09-18

1991-11-05

James, Andrew J.

357 70, 357 80, 357 81, H01L 2328

Patent

active

050634348

ABSTRACT:
According to this invention, a semiconductor chip incorporating a power control element is mounted on a heat dissipation member by a conductive solder, and lead members electrically connected to terminals extending from the semiconductor chip are arranged to have a surface level almost equal to that of the heat dissipation member. A main body structure including the semiconductor chip and the members is sealed by a sealing plastic body. A plastic table integrated with the sealing plastic body projects and is formed at a position corresponding to a lower side of outer leads which extends from the heat dissipation and lead members and is extracted from the sealing plastic body, and the outer leads are bent upward at a position corresponding to a position of the plastic table. The sealing plastic body is mounted on an external mounting member having a heat dissipation function.

REFERENCES:
patent: 4617585 (1986-10-01), Yasui

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