Plastic molded semiconductor package and method of manufacturing

Details Plastic molded semiconductor package and method of manufacturing Plastic molded semiconductor package and method of manufacturing

1997-11-24

1998-11-10

Picardat, Kevin

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Insulative housing or support

438127, H01L 2144

Patent

active

058343407

ABSTRACT:
A pad electrode is formed on a main surface of a semiconductor chip. A passivation film, which covers a surface portion of the pad electrode, is formed on the main surface of the semiconductor chip. An internal connection conductor is formed on a surface portion of the pad electrode. The semiconductor chip is covered with a molding resin which exposes only a top surface of the internal connection conductor. An external connection conductor is formed on a top surface of the internal connection conductor. The external connection conductor has a substantially flat top surface. Thereby, a plastic molded semiconductor package can be easily mounted on a printed board, and can have improved reliability after being joined on the printed board.

REFERENCES:
patent: 3625837 (1971-12-01), Nelson et al.
patent: 3959874 (1976-06-01), Coucoulas
patent: 4264917 (1981-04-01), Vgon
patent: 4620215 (1986-10-01), Lee
patent: 4784872 (1988-11-01), Moeller et al.
patent: 4942140 (1990-07-01), Ootsuki et al.
patent: 5019673 (1991-05-01), Juskey
patent: 5061657 (1991-10-01), Queen et al.
patent: 5120678 (1992-06-01), Moore et al.
patent: 5179039 (1993-01-01), Ishida et al.
patent: 5273938 (1993-12-01), Lin et al.
patent: 5289346 (1994-02-01), Garey et al.
patent: 5302553 (1994-04-01), Abbot et al.
patent: 5504035 (1996-04-01), Rostoker et al.
patent: 5519936 (1996-05-01), Andros et al.
patent: 5565379 (1996-10-01), Baba
patent: 5663106 (1997-09-01), Karavans et al.

Affiliated with

Also associated with

Rating

Plastic molded semiconductor package and method of manufacturing does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Plastic molded semiconductor package and method of manufacturing, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Plastic molded semiconductor package and method of manufacturing will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1516143