Plastic molded semiconductor package

Details Plastic molded semiconductor package Plastic molded semiconductor package

1994-04-28

1996-09-10

Mintel, William

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Bump leads

257778, 257787, 257796, H01L 2328

Patent

active

055548873

ABSTRACT:
A pad electrode is formed on a main surface of a semiconductor chip. A passivation film, which covers a surface portion of the pad electrode, is formed on the main surface of the semiconductor chip. An internal connection conductor is formed on a surface portion of the pad electrode. The semiconductor chip is covered with a molding resin which exposes only a top surface of the internal connection conductor. An external connection conductor is formed on a top surface of the internal connection conductor. The external connection conductor has a substantially flat top surface. Thereby, a plastic molded semiconductor package can be easily mounted on a printed board, and can have improved reliability after being joined on the printed board.

REFERENCES:
patent: 3959874 (1976-06-01), Coucoulas
patent: 4620215 (1986-10-01), Lee
patent: 4764804 (1988-08-01), Sahara et al.
patent: 5019673 (1991-05-01), Juskey
K. Clark and W. A. Klein "Joining Integrated Circuit Chips to Microcast Fingers". Apr. 1970 pp. 1981-1982.

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