Plastic molded semiconductor integrated circuit device with nail

Details Plastic molded semiconductor integrated circuit device with nail Plastic molded semiconductor integrated circuit device with nail

1986-02-20

1988-03-01

Scott, J. R.

Electricity: electrical systems and devices

Miscellaneous

357 71, H05K 114

Patent

active

047290633

ABSTRACT:
A plastic molded semiconductor integrated circuit device, includes: a semiconductor substrate in which circuit elements are fabricated, metal wirings for transmitting the power supply voltage or signals of internal circuits provided on the semiconductor substrate via an insulating film, a plurality of apertures produced at portions of the insulating film directly below the metal wirings, and a nail section provided integrally with the metal wiring in the aperture, wherein the nail section is provided without being electrically connected with any of the circuit elements or the other metal wirings.

REFERENCES:
patent: 3291578 (1966-12-01), Fahey
patent: 3604989 (1971-09-01), Haneta et al.
patent: 3838204 (1974-09-01), Ahn et al.
patent: 4150431 (1979-04-01), Nishihara et al.
patent: 4502210 (1985-03-01), Okumura et al.
patent: 4617730 (1986-10-01), Geldermans et al.
patent: 4630094 (1986-12-01), Wiley et al.
"Experimental and Mathematical Determination of Mechanical Strains Within Plastic IC Packages and Their Effect on Devices During Environmental Testing," R. J. Usell et al, IEEE/Proc. IPPS, pp. 65-73.
"Deformation of Al Metallization in Plastic Encapsulated Semiconductor Devices Caused by Thermal Shock", Masaaki Isagawa et al, 1980 IEEE.

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