Plastic molded pin-grid-array power package

Details Plastic molded pin-grid-array power package Plastic molded pin-grid-array power package

1988-05-09

1989-09-19

Grimley, Arthur T.

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

174 163, 29856, H01L 2328

Patent

active

048683493

ABSTRACT:
A molded pin-grid-array package includes a heat sink available at the face opposite to the pins. The heat sink is secured to a printed wiring board that has plated through holes therein that form the desired pin-grip-array and wires are secured in the holes to form the package pins. The heat sink covers an aperture in the board and the semiconductor die is secured to the heat sink inside the cavity thereby formed. After the semiconductor die is attached and the bonding pads connected to the metal traces on the board, the assembly is placed in a transfer mold. Plastic encapsulant is then transfer molded to encapsulate the semiconductor die and to extend flush with the heat sink to form a skirt around the periphery of the board. This leaves the molded package with an available heat sink face for efficient cooling after the package is mounted for ultimate use.

REFERENCES:
patent: 3585272 (1971-06-01), Shatz
patent: 3930114 (1975-12-01), Hodge
patent: 4618739 (1986-10-01), Theobald
patent: 4677526 (1987-06-01), Muehling
patent: 4688152 (1987-08-01), Chia

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