Plastic molded chip carrier package and method of fabricating th

Details Plastic molded chip carrier package and method of fabricating th Plastic molded chip carrier package and method of fabricating th

1987-01-29

1989-12-26

Hille, Rolf

Electricity: conductors and insulators

Feedthrough or bushing

Compression

357 74, 174 525, H01L 2328

Patent

active

048901520

ABSTRACT:
A novel plastic molded chip carrier package for an integrated circuit chip has a carrier member molded of a plastic material to which are integrally embedded a plurality of I/O pins and a conductor member for interconnection between the terminals of the chip and the corresponding I/O pins to provide a unitary construction obtained at a single molding process. This plastic molded chip carrier package is preferred to have integral positioning studs which project in the same direction of the I/O pins for abutment against a printed circuit board for mounting the package in a spaced relation thereto with the I/O pins plugged into metallized through holes provided in the board. A method of fabricating the plastic chip carrier package is also disclosed to comprise the steps of placing a plurality of I/O pins into corresponding vertical slots formed in a molding die with the top portion of the I/O pins projecting above the molding die surface; supporting a conductor member on the I/O pins with the distal top ends of the I/O pins extending into correspondingly through holes formed in the conductor member, the conductor member including a plurality of conductor lines for electrical interconnection between the individual I/O pins and the terminals of the chip; and filling a molten plastic material at least between the conductor member and the molding die surface and solidifying the same so as to form thereat a plastic carrier member to which the conductor member is integrally embedded together with the top portions of the I/O pins.

REFERENCES:
patent: 3495023 (1970-02-01), Hessinger et al.
patent: 3585272 (1971-06-01), Shatz
patent: 3684817 (1972-08-01), Card,Jr. et al.
patent: 4082394 (1978-04-01), Gedney et al.
patent: 4107727 (1978-08-01), Ikezawa et al.
patent: 4126882 (1978-11-01), Carson et al.
patent: 4322778 (1982-03-01), Barbour et al.
patent: 4326214 (1982-04-01), Trueblood
patent: 4338612 (1982-07-01), Braun
patent: 4513355 (1985-04-01), Schroeder et al.
patent: 4530002 (1985-07-01), Kanai
patent: 4618739 (1986-10-01), Theobald
patent: 4700473 (1987-10-01), Freyman et al.
patent: 4723156 (1988-02-01), Okuaki
Dion et al; Module Package; IBM Technical Disclosure Bulletin; vol. 7, No. 7, Dec. 1964, p. 556.
Funari et al; Flanged Pin MC Substrate Design; IBM Technical Disclosure Bulletin; vol. 21, No. 1, Jun. 1978, p. 94.
IBM Technical Disclosure Bulletin, vol. 27, No. 3, Aug. 1984, p. 1682, New York, U.S.; M. P. Bourgeois et al.: "Plastic Pin Array Package."
IBM Technical Disclosure Bulletin, vol. 15, No. 3, "Connector Interposer for Module-to-Board Electrical Interconnection"; R. L. Agard, et al.
IBM Technical Disclosure Bulletin, vol. 21, No. 1, Jun. 1978, "Flanged Pin Mc Substrate Design", J. Funari et al.
IBM Technical Disclosure Bulletin, vol. 15, No. 1, Jun. 1972, "Eighty-Pin Package for Field-Effect Transistor Chips"; Hohn.

Affiliated with

Also associated with

Rating

Plastic molded chip carrier package and method of fabricating th does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Plastic molded chip carrier package and method of fabricating th, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Plastic molded chip carrier package and method of fabricating th will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1579751