Plastic-molded apparatus of a semiconductor laser

Details Plastic-molded apparatus of a semiconductor laser Plastic-molded apparatus of a semiconductor laser

1995-12-29

1998-10-20

Crane, Sara W.

Active solid-state devices (e.g., transistors, solid-state diode

Incoherent light emitter structure

With reflector, opaque mask, or optical element integral...

257 99, 257675, 257676, 257693, H01L 3300

Patent

active

058250549

ABSTRACT:
A plastic-molded apparatus for a semiconductor laser is disclosed, which comprise: a first lead having a broad end thereof serving as a mounting plate; a second lead located at one side of the first lead; a third lead located at other side of the first lead; a submount, disposed on a front end of the mounting plate, having a semiconductor laser chip disposed thereon, electrically connected to the second lead, and a monitor detector disposed on the mounting plate closely adjacent to the submount, electrically connected to the third lead, for receiving backward light from the semiconductor laser chip; a plastic-molded header to fix the first lead, the second lead and the third lead; and a transparent cap, adapted to the plastic-molded header, for sealing all components including the laser chip, the monitor detector and peripheral parts on the plastic-molded header.

REFERENCES:
patent: 3267341 (1966-08-01), Euander
patent: 4995687 (1991-02-01), Nagai et al.
patent: 5500768 (1996-03-01), Doggett et al.

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