Plastic mold type semiconductor device

Details Plastic mold type semiconductor device Plastic mold type semiconductor device

1996-08-15

1998-06-16

Thomas, Tom

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

257676, 257784, H01L 23495

Patent

active

057675660

ABSTRACT:
The semiconductor device according to the present invention can prevent the peeling-off of the chip from the die pad or the crack in the package by improving the efficiency of discharging of the moisture in the device even if the pitch of the inner leads is small, and can improve the reliability of the semiconductor device. The semiconductor device according to the present invention comprises a die pad holding a semiconductor chip, leads, bonding wires, and a plastic package containing the semiconductor chip, the die pad, a part of each of the leads, and the bonding wires. The bonding wires connected to the die pad extend to the outside of the plastic package.

REFERENCES:
patent: 5220195 (1993-06-01), McShane et al.

Affiliated with

Also associated with

Rating

Plastic mold type semiconductor device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Plastic mold type semiconductor device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Plastic mold type semiconductor device will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1729219