Plastic mold package device decapsulator with flat, separate etc

Details Plastic mold package device decapsulator with flat, separate etc Plastic mold package device decapsulator with flat, separate etc

1993-09-15

1995-08-22

Fourson, George

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

With microwave gas energizing means

437923, 216 59, 216 90, C23F 102

Patent

active

054436753

ABSTRACT:
A decapsulation embodiment of the present invention comprises clamping a device-under-test to a fixture with a non-recessed etch head. The fixture has an etch plate with a hole that defines the area on the device-under-test for the decapsulation. Electrical access is provided to the package pins of the device-under-test. The fixture comprises a support with connections for the pins and the etch-resistant etch plate on top with the hole for locating over the site of the active die within the device-under-test package. The hole is sized to define the proper dissolved opening dimensions for decapsulation and is deep enough to enable decapsulation to start and yet not so deep that fresh etchant solution cannot reach the surface of the device-under-test. The device-under-test is placed on top of the support and covered with a etch plate. The whole assembly is then clamped together.

REFERENCES:
patent: 4344809 (1982-08-01), Wensink
patent: 4359360 (1982-11-01), Harris et al.
patent: 4384917 (1983-05-01), Wensink
patent: 4822441 (1989-04-01), Ohta et al.
patent: 4826556 (1989-05-01), Kobayashi
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patent: 5041229 (1991-08-01), Brock et al.
patent: 5252179 (1993-10-01), Ellerson et al.
Brochure, "Plastic Mold Decapsulation System PA102," Nippon Scientific Co., Ltd. (date unknown).
Naoki Yoshida, et al., "Plastic Mold Opener that Uses Fuming Nitric Acid as Dissolving Liquid," pp. 137-143. (date unknown).
Brochure and Application Notes, Novus Technologies "Jet Etch". (date unknown).

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