Plastic material pouring device for forming electronic component

Details Plastic material pouring device for forming electronic component Plastic material pouring device for forming electronic component

1994-12-02

1998-02-10

Sough, Hyung S.

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

174 524, H01L 2328, H01L 2301

Patent

active

057171637

ABSTRACT:
Disclosed is a plastic material pouring device for forming electronic components consisting of a cover and a leadframe corresponding to the cover in configuration, such that the cover is firmly joined and assembled with the leadframe with the help of a suitable tool to allow quick pouring of plastic material into the assembled cover and leadframe to form a desired electronic component. Such plastic material pouring device requires less material and reduced manufacturing cost while permits the leadframe to be produced in sheet form in a continuous manner and to have pins with desired shapes.

REFERENCES:
patent: 3469684 (1969-09-01), Keady et al.
patent: 3691289 (1972-09-01), Rohloff
patent: 5208467 (1993-05-01), Yamazaki

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