Plastic material package semiconductor device having a mechanica

Details Plastic material package semiconductor device having a mechanica Plastic material package semiconductor device having a mechanica

1978-04-25

1981-11-03

James, Andrew J.

357 70, 357 80, 29588, H01L 2328, H01L 2348, H01L 2944

Patent

active

042988837

ABSTRACT:
With a packaged semiconductor device of this invention, an IC pellet or chip supported on a mounting unit is encapsulated in plastics material, for example, epoxy resin or silicone resin. A plurality of lead strips are disposed at one end in the proximity of the mounting part of the mounting unit. The lead strips are electrically connected to the respective conductive pads of the IC pellet set on the mounting part of the mounting unit. The lead strips extend at the other end outside of an plastics material. Mounting unit-reinforcing side walls project substantially at right angles from the edges of the flat part of the mounting unit. The heat-radiating legs of the mounting unit extend substantially at right angles from the low edges of the side walls with the bottom surface of said legs exposed to the outside of the plastics material.

REFERENCES:
patent: 3114866 (1963-12-01), Iwata
patent: 3569797 (1971-03-01), Simmons
patent: 3574815 (1971-04-01), Segerson
patent: 3577633 (1971-05-01), Homma
patent: 3629668 (1971-12-01), Hingorany
patent: 3651448 (1972-03-01), Pauza
patent: 3665256 (1972-05-01), Goun et al.
patent: 3786317 (1974-01-01), Thierfelder
patent: 3914786 (1975-10-01), Grossi
patent: 3930114 (1975-12-01), Hodge
patent: 4023053 (1977-05-01), Shimizu et al.
patent: 4048670 (1977-09-01), Eysermans

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