Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Reexamination Certificate
2009-02-02
2010-02-09
Nguyen, Khiem (Department: 2839)
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
C439S083000
Reexamination Certificate
active
07658617
ABSTRACT:
An enhanced contact construction and loading support mechanism for plastic land grid array (PLGA) modules. A plurality of inverted hybrid land grid array (LGA) contacts are each respectively captured in and extend at least partially through one of a plurality of holes of an inverted hybrid LGA interposer. The inverted hybrid LGA contacts are affixed to a plurality of metal pads on a PLGA module carrier. Preferably, the inverted hybrid LGA contacts are affixed simultaneously using surface-mount technology (SMT) and have a metallurgy construction (e.g., beryllium-copper springs coated with nickel and hard gold) that provides enhanced wear and corrosion resistance. Each of the inverted hybrid LGA contacts is configured to make mechanical/pressure contact with a metal contact on another substrate, such as a printed wiring board (PWB). The inverted hybrid LGA interposer supports the PLGA module carrier and, in addition, a stiffener frame (with or without a heat sink) may be provided to reinforce the PLGA module carrier.
REFERENCES:
patent: 5152694 (1992-10-01), Bargain
patent: 5967797 (1999-10-01), Maldonado
Luc Guerin et al., “Spring Land Grid Array Development: An Integrated Demountable Solution”, MicroNews (A publication of IBM Microelectronics), Third Quarter 2001, pp. 22-24, vol. 7, No. 3, <http://www.-03.ibm.com/chips/micronews/vol7—no3/mn—vol7—no3—fnl.pdf.>.
Brodsky William Louis
Hoffmeyer Mark Kenneth
Bussan Matthew J.
International Business Machines - Corporation
Nguyen Khiem
LandOfFree
Plastic land grid array (PLGA) module with inverted hybrid... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Plastic land grid array (PLGA) module with inverted hybrid..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Plastic land grid array (PLGA) module with inverted hybrid... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4174411