Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1996-07-29
1997-10-28
Phillips, Michael W.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
361761, H05K 118
Patent
active
056822952
ABSTRACT:
A reinforcement structure to protect an integrated circuit module located within a smart card. The smart card has two semi-rigid layers, with a first opening through the first layer located below the second layer. The reinforcement structure, which has a modulus of elasticity higher than the modulus of elasticity of the smart card, has a first portion extending through the first opening and a second portion extending over the upper surface of the first card layer. The integrated circuit module is positioned in the second card layer and is separated from the reinforcement structure by the second card layer. The reinforcement structure, which can have various shapes, relives stress on the integrated circuit module during bending and torsion of the card.
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Horejs, Jr. Charles F.
Templeton, Jr. Thomas H.
Hoffman E. Eric
MacPherson Alan H.
Phillips Michael W.
Santa Clara, Inc.
US3, Inc.
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