Plastic integrated circuit card with reinforcement structure out

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

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361761, H05K 118

Patent

active

056731795

ABSTRACT:
A reinforcement structure to protect an integrated circuit module located within a smart card. The integrated circuit module is positioned in a cavity formed in a first surface of the smart card. The reinforcement structure, which has a modulus of elasticity higher than the modulus of elasticity of the smart card, is connected to a second surface and outer edge surfaces of the smart card. The first and second surfaces of the smart card are opposing surfaces and are joined by the outer edge surfaces at the outer perimeter of the smart card. In other embodiments, the reinforcement structure includes a second reinforcement structure connected to the first reinforcement structure and to the first surface of the smart card. The reinforcement structure relieves stress on the integrated circuit module during bending and torsion of the card.

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