Plastic article or earthenware shaping or treating: apparatus – Distinct means to feed – support or manipulate preform stock... – Opposed registering coacting female molds
Patent
1991-12-30
1994-01-04
Nguyen, Khanh P.
Plastic article or earthenware shaping or treating: apparatus
Distinct means to feed, support or manipulate preform stock...
Opposed registering coacting female molds
425117, 425544, 425DIG228, 264272170, 249095, B29C 4502, B29C 4514, B29C 4526
Patent
active
052755460
ABSTRACT:
An apparatus for encapsulating an integrated circuit lead frame in plastic is disclosed. This apparatus includes an upper mold and a lower mold which, when properly joined together, define the package area of the lead frame as well as a reservoir for the molten plastic and a conduit and flow pocket for assuring uniform flow of plastic into the package area of the molds. The integrated circuit lead frame has a flow hole to allow the molten plastic to flow from the conduit into the flow pocket and into the bottom portion of the package area. The conduit also allows the molten plastic to flow directly to the top portion of the package area. With the plastic being more uniformly injected into both (top and bottom) package or cavity areas at once, the likelihood of air pockets, and to overcome wiresweep cavities and other imperfections in the final plastic package is reduced.
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Nguyen Khanh P.
Weiss Harry M.
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