Plastic encapsulated semiconductor power device means and method

Details Plastic encapsulated semiconductor power device means and method Plastic encapsulated semiconductor power device means and method

1982-11-08

1986-02-04

James, Andrew J.

357 79, 357 75, H01L 21447, H01L 2330, H01L 2504

Patent

active

045689628

ABSTRACT:
A means and method is provided for forming power devices using multiple semiconductor die. Typically, several semiconductor die or die assemblies with contact disks are mounted on a base plate in a spaced apart relationship. A compliant connector member which supports a massive power terminal, bridges between the die to which it is bonded via crushable contact dimples, to form an assembly. The assembly deforms during insertion into the mold to accommodate thickness variations and seat the outward faces of the terminal and base plate against the matching mold faces. When the plastic molding compound is injected into the mold there is a net outward force which seals the outward terminal, base and corresponding mold faces together to prevent encroachment of the plastic therebetween.

REFERENCES:
patent: 3723836 (1973-03-01), Shekerjian et al.
patent: 3991461 (1976-11-01), Anderson
patent: 4047197 (1977-09-01), Schierz
patent: 4106052 (1978-08-01), Shierz
patent: 4249034 (1981-02-01), Fichot et al.
patent: 4390891 (1983-06-01), Bahlinger

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