Plastic encapsulated semiconductor device and structure for moun

Details Plastic encapsulated semiconductor device and structure for moun Plastic encapsulated semiconductor device and structure for moun

1991-01-29

1993-03-16

Hille, Rolf

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

257722, H01L 2330, H01L 2334, H01L 2336

Patent

active

051949350

ABSTRACT:
The plastic encapsulated semiconductor device according to the present invention has a semiconductor chip, leads, and members for electrically connecting these parts to each other. A part of leads, the semiconductor chip and the connecting members are encapsulated with a plastic to form a package. The plate type plastic fins formed on the surface of and integrally with the package are divided in two directions perpendicular to each other thereby forming, for example, rows and columns of fins or fin segments, on the package surface. Therefore, the semiconductor device according to the present invention can be molded easily by a transfer molding. It has a high reliability with respect to the prevention of cracks in the plastic, and a low thermal resistance, and is most suitably used to obtain a high-density package mounting structure.

REFERENCES:
patent: 3548927 (1970-12-01), Spurling
patent: 4369838 (1983-01-01), Asanuma et al.
patent: 4878106 (1989-10-01), Sachs
patent: 4899210 (1990-02-01), Lorenzetti et al.

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