Plastic encapsulated semiconductor device and method for manufac

Details Plastic encapsulated semiconductor device and method for manufac Plastic encapsulated semiconductor device and method for manufac

1984-01-24

1990-04-10

Hille, Rolf

357 72, H01L 2348, H01L 2312

Patent

active

049165186

ABSTRACT:
A semiconductor device has a lead frame. The lead frame has a mount portion and a lead portion. A semiconductor chip is mounted on one major surface of the mount portion of the lead frame. The semiconductor chip is connected by an electrical connecting means to the lead portion of the lead frame. An electrical insulating layer is formed on the other major surface of the mount portion of the lead frame. The mount portion, part of the lead portion of the lead frame, the semiconductor chip and the electrically connecting means, excluding the surface of the electrical insulating layer of the mount portion of the lead frame, are sealed or encapsulated by an electrical insulating member.

REFERENCES:
patent: 3629672 (1971-12-01), Van de Water
patent: 3878555 (1975-04-01), Freitag et al.
patent: 4339768 (1982-07-01), Keller et al.
patent: 4459607 (1984-07-01), Reid
patent: 4503452 (1985-03-01), Yokozawa et al.

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