Electrical generator or motor structure – Non-dynamoelectric – Piezoelectric elements and devices
Patent
1995-04-03
1998-06-02
Budd, Mark O.
Electrical generator or motor structure
Non-dynamoelectric
Piezoelectric elements and devices
310340, H01L 4108
Patent
active
057605262
ABSTRACT:
A plastic molded SAW device (50) is provided by flip-chipping a SAW die (28) onto a die flag (16) of a lead frame (10) and attaching the two (28, 10) together by an annular ring (26, 60, 62) of an insulating material or other solder, so that an active central portion (52) of the SAW die (28) faces the die flag (16) but is separated therefrom. Electrical contacts to the circuitry on the SAW die (28) are made, most conveniently by solder bumps (36) which seal to electrode fingers (18) on the lead frame (10). This provides a very small sealed void (40, 74, 82) immediately above the active portion (52) of the SAW die (28) so that the attached die (28) and lead frame (10) combination can be over molded with plastic encapsulant (38) without such plastic encapsulant (38) coming in contact with the active region (52) of the SAW die surface (42).
REFERENCES:
patent: 4028646 (1977-06-01), Ikushima et al.
patent: 4037176 (1977-07-01), Ono et al.
patent: 4047129 (1977-09-01), Ishiyama
patent: 4096455 (1978-06-01), Drummond
patent: 4188596 (1980-02-01), Miura
patent: 4191905 (1980-03-01), Yasuda et al.
patent: 4266156 (1981-05-01), Kizaki
patent: 4270105 (1981-05-01), Parker et al.
patent: 4405875 (1983-09-01), Nagai
patent: 4512198 (1985-04-01), Sinha et al.
patent: 4586382 (1986-05-01), Sinha
patent: 4699682 (1987-10-01), Takishima
patent: 4993000 (1991-02-01), Niitsuma
patent: 5010270 (1991-04-01), Greer
patent: 5051645 (1991-09-01), Brace et al.
patent: 5091051 (1992-02-01), Greer
patent: 5095240 (1992-03-01), Nysen et al.
patent: 5208504 (1993-05-01), Parker et al.
patent: 5215546 (1993-06-01), Cho et al.
patent: 5281883 (1994-01-01), Ikata et al.
patent: 5337026 (1994-08-01), Borchelt et al.
patent: 5471722 (1995-12-01), Yatsuda
patent: 5504980 (1996-04-01), Yoshingaga et al.
Budd Mark O.
Cunningham Gary J.
Mancini Brian M.
Motorola Inc.
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