Plastic encapsulated microelectronic device and method

Details Plastic encapsulated microelectronic device and method Plastic encapsulated microelectronic device and method

1993-04-27

1995-01-03

Hille, Rolf

Active solid-state devices (e.g., transistors, solid-state diode

Encapsulated

257779, 257706, H01L 2316, H01L 2328

Patent

active

053789288

ABSTRACT:
An encapsulated microelectronic device (100) including a base (101) and a semiconductor device (305) having a top and a bottom. The bottom is attached to the base (101). The semiconductor device (105) has a thickness in the range from one-fourth to three-fourths of a millimeter and has a bottom metallization consisting of aluminum (407)/chromium (405)
ickel (403)/gold (401). The semiconductor device (305) has a contact (115) attached to the top. The encapsulated microelectronic device (100) has a molded top (120) surrounding the semiconductor device (305). The molded top (120) is made from low stress molding material.

REFERENCES:
patent: 4218695 (1980-08-01), Egerbacher et al.
patent: 4568962 (1986-02-01), Kalfus
patent: 4568962 (1986-02-01), Kalfus
patent: 4639759 (1987-01-01), Neidig et al.
patent: 4920405 (1990-04-01), Itoh et al.
patent: 5028741 (1991-07-01), Sanders et al.
patent: 5105259 (1992-04-01), McShane et al.
patent: 5172215 (1992-12-01), Kobayashi et al.

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