Metal working – Method of mechanical manufacture – Electrical device making
Patent
1995-06-02
1996-07-16
Echols, P. W.
Metal working
Method of mechanical manufacture
Electrical device making
29841, 26427211, 26427213, H05K 334
Patent
active
055355102
ABSTRACT:
An encapsulated microelectronic device (100) including a base (101) and a semiconductor device (305) having a top and a bottom. The bottom is attached to the base (101). The semiconductor device (105) has a thickness in the range from one-fourth to three-fourths of a millimeter and has a bottom metallization consisting of aluminum (407)/chromium (405)
ickel (403)/gold (401). The semiconductor device (305) has a contact (115) attached to the top. The encapsulated microelectronic device (100) has a molded top (120) surrounding the semiconductor device (305). The molded top (120) is made from low stress molding material.
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Anderson Samuel J.
Baird John
Kalfus Martin A.
Coley Adrian L.
Echols P. W.
Motorola Inc.
Neel Bruce T.
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