Plastic encapsulated integrated circuit package with electrostat

Details Plastic encapsulated integrated circuit package with electrostat Plastic encapsulated integrated circuit package with electrostat

1988-10-21

1990-08-28

Davie, James W.

357 72, H01L 2348

Patent

active

049530070

ABSTRACT:
A plastic encapsulated integrated circuit package in which a chip is secured to the upper surface of a base and is connected to leads which have their lower surfaces in a plane above that of the bottom of the base. An electrostatic shield is electrically connected to the bottom of the base and underlies the leads without touching them, to reduce crosstalk. The support for the base is integrally connected by a conductive strip to the lead for the ground pin of the chip, to ground the shield. The whole is plastic encapsulated. To permit encapsulation, the shield extends towards but stops short of the dam bars for the leads.

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