Package making – Methods – Forming or partial forming a receptacle and subsequent filling
Reexamination Certificate
2011-08-02
2011-08-02
Gerrity, Stephen F (Department: 3721)
Package making
Methods
Forming or partial forming a receptacle and subsequent filling
C053S471000, C053S559000, C053S281000, C053S051000, C053S077000
Reexamination Certificate
active
07987653
ABSTRACT:
An embossed carrier tape manufacturing apparatus includes features for integrating with other processing equipment so that other processes such as forming, filling, and sealing the tape can be performed sequentially in one integrated process. The apparatus includes retractable contact spot heaters for heating the tape prior to embossing, along with a unique heat shield arrangement that is interposable between the heaters and the tape so that the process may be paused. Also, a synchronizing apparatus is integrated so that the carrier tape embossing process may be automatically paused for adjusting to the input rate of other carrier tape processing apparatus.
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Machine translation of JP 10-1120, retrieved from JPO website, http://www4.ipdl.inpit.go.jp/Tokujitu/tjsogodbenk.ipdl, Sep. 8, 2010, 8 pages.
Ikeda Tomaki, et al., Embossment Carrier Tape Molding Machine, Japane Patent Publication No. 2000-062023—English Machine Translation, Publication Date of Feb. 29, 2000.
Gregerson Barry L.
Spitzer James E.
Adaptsys Limited
Bourget Anthony J.
Gerrity Stephen F
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