Plastic chip carrier package

Details Plastic chip carrier package Plastic chip carrier package

1985-05-20

1986-10-21

Grimley, Arthur T.

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

29588, H01L 2302

Patent

active

046187391

ABSTRACT:
A pin grid array package is disclosed for an integrated circuit chip having a preformed main body member of a first synthetic organic polymer with a central cavity in which the integrated circuit chip is mounted, a metallized layer of a second synthetic organic polymer being bonded to said preformed main body member for electrical interconnection to the chip, and with terminal pins protruding from said preformed main body member as a means to further electrically interconnect the chip to exterior electrical terminals. A method to form said main body member is also disclosed using a thermoplastic polymer wherein the terminal pins along with a recessed base element provided in said body member for improved thermal conductivity are included when said main body member is first molded. A further method whereby the integrated circuit chip is assembled in said plastic carrier package is also disclosed.

REFERENCES:
patent: 3495023 (1970-02-01), Hessinger et al.
patent: 4132856 (1979-01-01), Hutchison et al.
patent: 4396936 (1983-08-01), McIver et al.
patent: 4396971 (1983-08-01), Beall et al.
patent: 4437141 (1984-03-01), Prokop

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